发明名称 FLEXIBLE MECHANICAL PACKAGING FORM FACTOR FOR RACK MOUNTED COMPUTING DEVICES
摘要 The present invention comprises a dual-use form factor for rack mounting equipment. In particular, the form-factor is configured so that it can be both rack-mounted directly or installed within a chassis. In addition, the form-factor may comprise one or more blind-mate connector systems that are suitable for blunt-type connectors, such as PCIe connectors.
申请公布号 US2009250236(A1) 申请公布日期 2009.10.08
申请号 US20080098988 申请日期 2008.04.07
申请人 KICKFIRE, INC. 发明人 CORWIN MICHAEL;NGUYEN DUONG;CHAMDANI JOSEPH I.
分类号 H05K5/00;H01R13/46 主分类号 H05K5/00
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