| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayer wiring board, along with its manufacturing method, capable of effectively using a conductive paste and reducing a manufacturing cost of the ceramic multilayer wiring board. SOLUTION: In the manufacturing method of a ceramic multilayer wiring board 10, four first holes 2 surrounding an arbitrary point P are respectively provided to six ceramic green sheets 1A and 1B, which are packed with conductive paste 3. The conductive paste 3 in each layer is partially contacted to a conductive paste 3 in its upper or lower layer as well as the ceramic green sheet 1A (1B), and the six ceramic green sheets 1A and 1B are laminated/press-bonded. Second holes 4 are so provided as to overlap the first holes 2 respectively so that the conductive paste 3 is exposed, after that, the ceramic green sheets 1A and 1B are baked. COPYRIGHT: (C)2010,JPO&INPIT |
