| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape which can be used in an expanding step for dividing an adhesive layer, and having a small anisotropy in expandability. SOLUTION: The wafer processing tape 10 is an expandable wafer processing tape used in dividing the adhesive layer 13 along a chip by its expansion, and has a base material film 11 having a plurality of resin layers 11a, 11b laminated so that the film forming directions (MD) may not coincide with each other, and an adhesive layer 12 provided on the base material film 11. COPYRIGHT: (C)2010,JPO&INPIT
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