| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition for film formation capable of forming an insulating film that has a low dielectric constant and excellent mechanical strengths and has good surface properties (film surface properties) and heat resistance. Ž<P>SOLUTION: The composition for film formation comprises a polymer (A) comprising a monomer unit represented by formula (1) (wherein R<SP>1</SP>is an alkyl group or an aryl group; X is -COOR<SP>2</SP>, -CON(R<SP>2</SP>)<SB>2</SB>or -CN; R<SP>2</SP>is a hydrogen atom, an alkyl group or an aryl group; and when a plurality of R<SP>2</SP>exist, they may be the same or different from each other and may be linked together to form a ring structure). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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