| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the base of a metal bump provided on a first member or a second member from being damaged when ultrasonically bonding the first member and the second member through the metal bump. Ž<P>SOLUTION: In the ultrasonic bonding method for ultrasonically bonding the first member 11 and the second member 4 fixed on a bulky member 3 through the metal bump 8, when the first member 11 is attached to an ultrasonic vibration head 10 and the bulky member 3 is attached to the upper surface of the stage 2 of an ultrasonic bonding apparatus 1, the bulky member 3 is configured so as to be slidable immediately after oscillation is started on the upper surface of the stage 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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