| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an automatic visual inspection device capable of certainly performing the automatic visual inspection in the chip invalid region of a semiconductor wafer and capable of preventing the probe of a probe device from being damaged by the foreign matter adhered to the chip invalid region when inspecting the probe, and an automatic visual inspection method. Ž<P>SOLUTION: The automatic visual inspection device 1, constituted so as to automatically performing the visual inspection of the chip invalid region (HR) formed in the vicinity of the outer periphery of the semiconductor wafer (K), is equipped with an imaging optical system (5) for imaging the chip invalid region (HR), a dark visual field illumination means (8) for performing dark visual field illumination toward the chip invalid region (HR) from directions inclined by predetermined angles (ϕ1 and ϕ2) with respect to the optical axis (J1) of the imaging optical system (5) and a determining means (9B) for determining the presence of the foreign matter (IB) in the chip invalid region (HR) on the basis of the image of scattered lights (L1' and L2') obtained by imaging the chip invalid region (HR) by the imaging optical system (5) in a state that dark visual field illumination is performed by the dark visual field illumination means (8). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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