| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a camera module and a hot melt molding method which eliminates a work for filling up a clearance between a pedestal mount and a circuit board in a post process, and achieves a downsizing by reducing a protruding portion of an adhesive or the like. Ž<P>SOLUTION: The pedestal mount 3 is structured such that groove portions 3f and 3g are formed in a side wall portion 3e of a rectangular portion 3b. The groove portions 3f and 3g are formed in an outer surface of the side wall portion 3e, and are formed in such a manner as to cut between an upper surface portion 3h and a bottom surface portion 3i of the rectangular portion 3b all over. A hot melt portion made of a thermoplastic resin molten at reflow temperature is formed in the bottom surface portion 3i. When the pedestal mount 3 is set on the circuit board and put in a reflow furnace, the hot melt portion is molten at the reflow temperature and the thermoplastic resin is expanded on the circuit board and protrudes from the outer surface of the side wall portion 3e. The protrusive amount is reduced by the groove portions 3f and 3g. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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