| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling device for electronic apparatus that locally cools the periphery, or the like of an IC chip in various electronic apparatus, and has excellent cooling performance. <P>SOLUTION: The cooling device for electronic apparatus 10 directly or indirectly abuts on a heat generation source 50, such as an IC chip, and uses a heat sink 20, where a number of cooling fins 22 are erected in parallel at an appropriate interval at a base 21. In the cooling device for electronic apparatus, a diaphragm 43 of vibratory apparatus 40 is inserted among a number of cooling fins 22, 22 of the heat sink 20, an opening 22a for outside air is provided in the entire or partial portion of a number of cooling fins 22 of the heat sink 20, and an opening formation position is set inside the insertion length of the diaphragm of the vibratory apparatus 40. The opening 22a for outside air introduces outside air when the vibratory apparatus 40 vibrates, thus improving cooling performance. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
