发明名称 CASE MOLDED CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case molded capacitor dealing with current increase and capacitance increase and being used for a hybrid vehicle or the like. SOLUTION: A fastening part 3 is provided on one side face of a case 5 for a case molded capacitor in which an element connecting a bus bar 4 comprising a connecting part 4b to one terminal thereof is housed within the case 5 and resin-molded and by abutting and coupling the fastening parts 3 of two cases 5 while disposing the connecting part 4b provided in the bus bar 4 in the fastening part 3, two case molded capacitors are electrically and mechanically connected. Thus, since the case 5 is reduced in size, a mold resin 6 can be uniformly injected into the case 5 thereby performing high-quality molding and further, bisected capacitors are electrically and mechanically connected, thereby dealing with current increase and capacitance increase. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009231524(A) 申请公布日期 2009.10.08
申请号 JP20080074906 申请日期 2008.03.24
申请人 PANASONIC CORP 发明人 IMAMURA TAKESHI
分类号 H01G4/18;H01G2/02;H01G4/38 主分类号 H01G4/18
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