| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a micro solder bump and a solder paste for use in forming this micro solder bump. <P>SOLUTION: In the method for forming the micro solder bump, the solder paste which contains a flux of 5-20 mass% not containing an activator, and in which the remnant is made of a solder alloy powder having a mean particle size of 5μm or less is coated, an activator containing activated material in which the activator is melted in a solvent is coated on this coated solder paste, and subsequently a reflow process is performed. The solder paste is used for forming the micro solder bump which contains the flux of 5-20 mass% not containing the activator, and in which the remnant is made of the solder alloy powder having the mean particle size of 5μm or less. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
