| 摘要 |
The present invention discloses a process for joining materials. The process can include providing a first component with a first joint face and a second component with a second joint face. The first component, second component, and bonding layer can be assembled such that the first joint face is oppositely disposed from the second joint face with the bonding layer located at least partially therebetween. Heat can be applied to the first joint face and the second joint face with the bonding layer therebetween. In this manner, wetting and possibly slight dissolving of the first joint face and the second joint face can be afforded, with at least part of the bonding layer being vaporized. In addition, the first joint face can come into intimate contact with the second joint face and form a bond interface, with the first component being bonded to the second component across the bond interface.
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