| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT |
| 摘要 |
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
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| 申请公布号 |
US2009250798(A1) |
申请公布日期 |
2009.10.08 |
| 申请号 |
US20090484131 |
申请日期 |
2009.06.12 |
| 申请人 |
BATHAN HENRY D;SHIM IL KWON;PUNZALAN JEFFREY D;CAMACHO ZIGMUND RAMIREZ |
发明人 |
BATHAN HENRY D.;SHIM IL KWON;PUNZALAN JEFFREY D.;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L23/495;H01L21/56;H01L23/28;H01L23/498 |
主分类号 |
H01L23/495 |
| 代理机构 |
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