CU-NI-SI-CO-CR ALLOY FOR ELECTRONIC MATERIAL

摘要

The issue is to provide a Corson alloy which has significantly improved characteristics, specifically high strength and high conductivity, by better demonstrating the effect of Cr addition to a Cu-Ni-Co-Si type alloy. Disclosed is a copper alloy for electronic materials comprising Ni: 1.0-4.5 mass%, Si: 0.50-1.2 mass%, Co: 0.1-2.5 mass%, Cr: 0.0030-0.3 mass%, and Cu and unavoidable impurities as the remainder. The mass concentration ratio of the total mass of Ni and Co with respect to Si (the [Ni+Co]/Si ratio) is 4 = [Ni+Co]/Si = 5. For the Cr-Si compound with a size in the range of 0.1-5 µm dispersed in the material, the atom concentration ratio of Cr to Si in the dispersed particles is 1 to 5, and the distribution density is from 1x104 particles/mm2 to 1x106 particles/mm2.