| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition with which an interlayer dielectric having high surface hardness, excellent heat resistance and solvent resistance, and further having low dielectric constant can be formed, and with which a microlens with an excellent melted shape can be formed. <P>SOLUTION: The radiation sensitive resin composition includes: a copolymer of a mixture of unsaturated compounds containing at least one selected from a group comprising an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and an unsaturated compound having an oxetanyl group; a 1,2-quinonediazide compound; and a carboxylic acid with a molecular weight of ≤1,000. <P>COPYRIGHT: (C)2010,JPO&INPIT |
