发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of reducing the installation area of an apparatus having a main conveyance mechanism for conveying a substrate to a plurality of processing units. <P>SOLUTION: Coating processing units 31a-c are provided at one side in a nearly horizontal direction perpendicularly crossing a conveyance route R of the main conveyance mechanism T for coating. Each of the adjacent coating processing units 31a-c is arranged while forming a line in a slanting direction to the conveyance route R in a plan view, thus shortening the conveyance route R of the main conveyance mechanism T for coating as compared with when arranging the respective coating processing units 31a-c in parallel with the conveyance route R. Also, a space for installing the coating processing units 31a-c can be shortened for the length in the direction of the conveyance route R. In this manner, the installation area of the main conveyance mechanism T for coating and the coating processing units 31a-c can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009231625(A) 申请公布日期 2009.10.08
申请号 JP20080076609 申请日期 2008.03.24
申请人 SOKUDO CO LTD 发明人 OTANI MASAMI;BJORKMAN KLAAS
分类号 H01L21/027;G02F1/13;G11B7/26 主分类号 H01L21/027
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