发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus uniformly generating plasma on a loading surface. <P>SOLUTION: An upper electrode 20 includes an opposing part 22 having an opposing surface 22A opposing the loading surface 10A, an outer peripheral part 24 having a flat surface 24A connected to an outer periphery of the opposing surface 22A, and a plurality of projecting parts 26 formed on the opposing surface 22A. The outer periphery of the opposing part 22 is superseded on the outer periphery of a lower electrode 10 on the projected surface substantially parallel to the loading surface 10A, and the outer periphery of the outer peripheral part 24 surrounds the outer periphery of the opposing part 22. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009228032(A) 申请公布日期 2009.10.08
申请号 JP20080072495 申请日期 2008.03.19
申请人 SANYO ELECTRIC CO LTD 发明人 AYA YOICHIRO
分类号 C23C16/509;H01L21/3065;H01L21/31;H05H1/46 主分类号 C23C16/509
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