| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a soldering method for simultaneously soldering components to be soldered to a substrate on both faces without need of establishing a drying process for temporarily fixing the component to be soldered and a process for inverting the substrate and without limiting solder to a cream-like solder paste. <P>SOLUTION: The substrate 12 is supported on a support stand 11 while leaving a prescribed interval with a solder 18 arranged on a semiconductor element 13 soldered on a lower face of the substrate. The substrate is supported with a substrate supporting jig 14 positioning the semiconductor element 13. The semiconductor element 13 to be soldered onto an upper face of the substrate is arranged on the upper face of the substrate 12 in a state where the solder 18 is placed between the semiconductor element and the substrate 12. The substrate 12, the semiconductor element 13, solder 18 and the substrate supporting jig 14 are heated in such a state and solder is melted. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
