MANUFACTURING APPARATUS OF SEMICONDUCTOR SUBSTRATE WITH ELECTRIC WIRE, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE WITH ELECTRIC WIRE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a semiconductor substrate with an electric wire and a method of manufacturing the semiconductor substrate with the electric wire capable of properly attaching the electric wire to the semiconductor substrate while controlling the deterioration of the electric wire.

SOLUTION: The manufacturing apparatus includes: a movable chuck 21 for pulling out the belt shaped electric wire R in roll; a loading guide 30 for loading the pulled out electric wire R and correcting the bend in the width direction; and a transfer arm 28 for keeping the electric wire R loaded on the loading guide 30 in the state of the bend being corrected and transferring to the semiconductor substrate. The twist bend can also be corrected by pressing the transfer arm 28 to the electric wire R loaded on the loading guide 30. The pulled out electric wire R is transferred on the semiconductor after being cut. It becomes possible to attach the electric wire R to the semiconductor substrate without tensile plastic deformation by transferring to the semiconductor substrate while keeping in the state of the bend being corrected.

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