| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To cool efficiently each heating element which is easily fitted between each circuit substrate located in opposition to each other and is mounted on each circuit substrate. <P>SOLUTION: A first heat transfer board 110 transfers a heat from one surface 111, with which a heating element or a heat transfer component transferring a heat from a heating element contacts, to another surface 112. A second heat transfer board 120 transfers a heat from one surface 121, with which a heating element or a heat transfer component transferring a heat from a heating element contacts, to another surface 122. The first heat transfer board 110 and second heat transfer board 120 are located so as to have a space 140 between the surface 111 and 121 against each other. An elastic radiation fin 130 is positioned, sandwiched between the surfaces 111 and 121. The elastic radiation fin 130 has an elasticity in an opposite direction of the first heat transfer board 110 and second heat transfer board 120 and radiates each heat of the surface 111 and surface 121. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
