| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method which can suppress a polymerized film at the back side of a substrate, a support stand side or the like caused by the infiltration of a raw material monomer into the back side of the substrate and the support stand, can improve the using efficiency of the raw material monomer, and further can suppress the reduction in the production yield of the polymerized film caused by the occurrence and intrusion of dust, particularly, upon the formation of a vapor deposition polymerized film. Ž<P>SOLUTION: In such a manner that the outer circumferential edge part 14A of the substrate 14 is exposed, the substrate 14 is supported onto a support stand 11. The outer circumferential edge part 14A of the substrate 14 is heated by a heater 12, and further, a film formation region located in the central part of the substrate 14 is held to a prescribed temperature by a temperature adjustment mechanism 13. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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