| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor chip can acquire a semiconductor chip at a high production efficiency, without causing breakages or contamination. SOLUTION: The manufacturing method of a semiconductor chip comprises a dicing process, in which a wafer secured to a transparent support plate through a both-sided adhesive tape is diced to separate semiconductor chips; a light irradiation process, in which respective semiconductor chips are irradiated with light from the side of transparent support plate; and a pickup process in which a semiconductor chip is picked up by a needleless pickup method. An adhesive layer comprising a gas generating agent which generates gas by stimulation is formed on one surface of base material of the double-sided adhesive tape, while an adhesive layer, comprising a photocuring resin is formed on the other surface. In the dicing process, the adhesive layer comprising the gas generating agent of the both-sided adhesive tape is bonded to contact the transparent support plate while the adhesive layer comprising the photo-curing resin is bonded to contact the wafer. In the light radiating process, the light is so radiated that the amount of radiation increases as approaches the center of the semiconductor chip while decreases when approaches an end part. COPYRIGHT: (C)2010,JPO&INPIT
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