发明名称 MICROMECHANICAL APPARATUS AND MANUFACTURING METHOD OF MICROMECHANICAL APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide manufacturing equipment and a manufacturing method of a micromechanical apparatus can improve the removal speed of a sacrifice layer and shorten a time required for the removal. Ž<P>SOLUTION: A thin-film apparatus 30 as the manufacturing equipment of a micromechanical apparatus 1 is provided with a chamber 31 on its principal surface for storing a substrate 11 that is formed with an MEMS element 16 that has a mechanism deformed by the operation of an electric field and changes its electric characteristics with the deformation, and a first sealing body 21 that covers the MEMS element 16 via the sacrifice layer 18 and has an opening-shape portion 21a communicated with the sacrifice layer 16. The interior of the chamber 31 disposed with the substrate 11 is provided with an introduction section 33 that introduces etching gas 37a for removing the sacrifice layer 18 by an etching process, an exhaust section 35 for exhausting the fluid in the chamber 31, and a narrowing portion 3436, as an adjustment means, for varying the amount of the fluid in the chamber 31 during the etching process. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009226500(A) 申请公布日期 2009.10.08
申请号 JP20080071572 申请日期 2008.03.19
申请人 TOSHIBA CORP 发明人 OBATA SUSUMU;INOUE MICHINOBU;MIYAGI TAKESHI
分类号 B81C1/00;H01H49/00;H01L21/302 主分类号 B81C1/00
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