发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 In order to recognize grid-like reference marks on a jig plate positioned in a mounting area by means of a substrate recognizing camera respectively, to obtain a positional shift amount of a mounting head with respect to XY coordinates on an apparatus of each of the reference marks, and to correct a mounting position, thereby carrying out a mounting operation, a jig component positioned and mounted sequentially on each of the reference marks formed on the jig plate by means of a nozzle head is recognized by the substrate recognizing camera, a shift amount of XY coordinates acquired by the camera recognition of the jig component from XY coordinates on the apparatus of the corresponding reference mark is obtained as corrected data on the nozzle head with respect to the reference mark, and a correction is carried out based on the corrected data when an electronic component is to be mounted on a substrate by means of the nozzle head.
申请公布号 US2009252400(A1) 申请公布日期 2009.10.08
申请号 US20090414207 申请日期 2009.03.30
申请人 JUKI CORPORATION 发明人 IWASE ATSUSHI
分类号 G06K9/00;H04N7/18 主分类号 G06K9/00
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