SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE AND PORTABLE APPARATUS

摘要

Production efficiency of a CSP-type semiconductor module is improved in a method for manufacturing the semiconductor module. The semiconductor module manufacturing method includes a step of bonding a semiconductor wafer (1), which has a plurality of semiconductor elements (10) each of which has an element electrode (12) formed thereon, on an expansible first insulating resin layer (20); a step of dicing the semiconductor wafer (1); a step of expanding the first insulating resin layer (20) to widen a gap between semiconductor elements (10); a pressure-bonding step of pressure-bonding a metal plate whereupon an electrode is arranged and the semiconductor elements (10) with the widened gaps in between, by having a second insulating resin layer in between, and electrically connecting the electrode and the element electrodes (12); a step of forming a wiring layer which corresponds to each semiconductor element (10) by selectively removing the metal plate and forming a plurality of semiconductor modules connected by the first insulating resin layer (20) and the second insulating resin layer; and a step of separating the semiconductor modules by cutting the first insulating resin layer (20) and the second insulating resin layer.