发明名称 MAGNETIC CONTROL SPUTTERING TARGET STRUCTURE AND EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a magnetic control sputtering target structure and equipment which uniformize the wear of a target material and improve the durability of the target material. Ž<P>SOLUTION: The magnetic control sputtering target structure comprises a drive device, at least two rotation shafts and a plurality of magnetic bars, wherein the drive device is twisted on the rotation shaft to form a drive device type drive structure, and the magnetic bars are arrayed on the drive device in parallel. The magnetic control sputtering target equipment comprises the magnetic control sputtering target structure, and also comprises a target material which is arranged on the outer side of the drive device type drive structure. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009228129(A) 申请公布日期 2009.10.08
申请号 JP20080301647 申请日期 2008.11.26
申请人 BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO LTD 发明人 WENYU ZHANG;XIN ZHAO
分类号 C23C14/35 主分类号 C23C14/35
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