发明名称 Methods of Forming Asymmetric Recesses and Gate Structures that Fill such Recesses and Related Methods of Forming Semiconductor Devices that Include such Recesses and Gate Structures
摘要 In a method of forming an asymmetric recess, an asymmetric recessed gate structure filling the asymmetric recess, a method of forming the asymmetric recessed gate structure, a semiconductor device having the asymmetric recessed gate structure and a method of manufacturing the semiconductor device, a semiconductor substrate is etched to form a first sub-recess having a first central axis. A second sub-recess is formed under the first sub-recess. The second sub-recess is in communication with the first sub-recess. The second sub-recess has a second central axis substantially parallel with the first central axis. The second central axis is spaced apart from the first central axis.
申请公布号 US2009250749(A1) 申请公布日期 2009.10.08
申请号 US20090483276 申请日期 2009.06.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK SE-KEUN
分类号 H01L29/78 主分类号 H01L29/78
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