| 发明名称 |
CHIP ASSEMBLY, CONNECTING ASSEMBLY, LED AND METHOD FOR PRODUCING A CHIP ASSEMBLY |
| 摘要 |
The invention relates to a chip assembly for an optoelectronic component, comprising at least one semiconductor chip (1) emitting electromagnetic radiation and a connecting assembly, said connecting assembly (2) having a plurality of planes (3, 4) that are electrically insulated from each other. |
| 申请公布号 |
WO2009067996(A3) |
申请公布日期 |
2009.10.08 |
| 申请号 |
WO2008DE01931 |
申请日期 |
2008.11.21 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;BRUNNER, HERBERT;KOEHLER, STEFFEN;SCHWARZ, RAIMUND;GROETSCH, STEFAN |
发明人 |
BRUNNER, HERBERT;KOEHLER, STEFFEN;SCHWARZ, RAIMUND;GROETSCH, STEFAN |
| 分类号 |
H01L25/075;H01L33/48;H01L33/62;H05K1/18 |
主分类号 |
H01L25/075 |
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