发明名称 |
ELECTRONIC COMPONENT USED FOR WIRING AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An electronic component used for wiring is configured to arrange a circuit element including a semiconductor chip. The circuit element is connected with a wiring pattern arranged on the rear surface of the electronic component. An electronic device package is connected with an external electrode positioned on the front surface on the side reverse to the wiring pattern through a vertical wiring. The electronic component is assembled into the electronic device package. The electronic component used for wiring is comprised of an electrically conductive supporting member serving as an electroforming matrix and a plurality of vertical wiring members integrally connected on the supporting member by applying an electroforming method. |
申请公布号 |
WO2009123048(A1) |
申请公布日期 |
2009.10.08 |
申请号 |
WO2009JP56273 |
申请日期 |
2009.03.27 |
申请人 |
KYUSHU INSTITUTE OF TECHNOLOGY;ISHIHARA, MASAMICHI;UEDA, HIROTAKA |
发明人 |
ISHIHARA, MASAMICHI;UEDA, HIROTAKA |
分类号 |
H01L25/10;H01L23/12;H01L25/11;H01L25/18 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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