PHOTOSENSITIVE FILM LAMINATION METHOD, RESIST PATTERN FORMATION METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

A photosensitive film, which has a support film and a 2 to 10-µm thick photosensitive resin composition layer formed on said support film, is placed on a copper substrate with the photosensitive resin composition layer in contact with the copper substrate and is laminated to the copper substrate under a lamination pressure of 1-10 MPa. As a result, even though the aforementioned photosensitive resin composition layer thickness is 10 µm or thinner, the occurrence of microvoids can be inhibited sufficiently when the photosensitive film is laminated to the copper substrate, so a sufficient level of resolution can be achieved.