PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that gives a cured relief pattern with high resolution on copper or a copper alloy, as a useful coating film for manufacturing electric and electronic materials, and to provide a pattern forming method, a semiconductor device and a method for manufacturing the device using the above composition.

SOLUTION: The photosensitive resin composition contains: (A) 100 parts by mass of a polyimide precursor having a specified structure or a polybenzoxazole precursor having a specified structure; (B) 1 to 40 parts by mass of a photosensitive agent; and (C) 0.1 to 20 parts by mass of a phenolic compound having a specified structure.

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