发明名称 CONDUCTIVE INK FOR OFFSET PRINTING, AND CIRCUIT PATTERN FORMING METHOD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive ink which is suitable to an offset printing used for forming an electrode and a circuitry, preferably used for a low-temperature calcination, performed in particular at a temperature below 600°C, and concurrently satisfying a low specific resistance after forming patterns, superior line configuration of the pattern, and superior printing or transcription performance. <P>SOLUTION: The above subject can be solved, by using the conductive ink; that is, specific surface is 0.5 to 5 m<SP>2</SP>/g, an average particle diameter D50 is 0.1 to 2μm, a tap density is 3 to 6 g/cm<SP>3</SP>, a silver powder with 20 to 50 nm crystal diameter and an organic compound are contained as an essential component, and a 0.1 to 10 mass% glass frit is contained with a softening point at a range of 350 to 500°C. The ratio toη5 (η1/η5) is 2 to 6 between the viscosity at 25°C, when the cutting speed is 2s<SP>-1</SP>, and the viscosityη1 at 25°C, when the cutting speed is 10s<SP>-1</SP>. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009231059(A) 申请公布日期 2009.10.08
申请号 JP20080075292 申请日期 2008.03.24
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 OTANI KAIRI;OGI KOZO
分类号 H01B1/22;B82Y30/00;B82Y99/00;C09D11/02;C09D11/023;C09D11/033;C09D11/037;C09D11/52;H01B1/00;H01B13/00;H05K3/12 主分类号 H01B1/22
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