| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing tape preventing a supporting layer formed on both ends of the tape from being peeled from a mold release film when the tape is processed or used while maintaining a function of suppressing a transfer mark when the tape is rolled up. Ž<P>SOLUTION: This wafer processing tape 10 has: a long mold release film 11, a circular adhesive layer 12, a circular sticky tape 13 and a supporting layer 20. The supporting layer 20 has a narrowest portion N which has the smallest width and resides on an extension line of the diameter of the sticky tape 13 parallel to the width direction of the mold release film 11. The supporting layer 20 has also a stack structure of a supporting adhesive layer 22 having the same composition as that of the adhesive layer 12 and a supporting sticky tape 23 having the same composition as that of the sticky tape 13 in a region R including the narrowest portion N, and has a single layer structure consisting of the supporting sticky tape 23 having the same composition as that of the sticky tape 13 in a double-side regions sandwiching the region R in the longitudinal direction of the mold release film 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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