发明名称 SILICON WAFER MULTIPLE-POINT TEMPERATURE MEASURING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a silicon wafer multiple-point temperature measuring instrument which uses a temperature sensor at multiple points of a measurement object to measure temperature thereof and transmits/receives a signal between the temperature sensor and the temperature measuring instrument by radio when performing temperature measurement. SOLUTION: This instrument transmits a predetermined sweep signal wave to a plurality of piezoelectric oscillators attached to a silicon wafer material in silicon wafer heating means and a sensor antenna section attached together with the piezoelectric oscillators, receives a reverberant oscillatory wave of the piezoelectric oscillators, measures a frequency of this reverberant oscillatory wave, and measures a surface temperature of the silicon wafer material based on the measured frequency. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009229428(A) 申请公布日期 2009.10.08
申请号 JP20080078765 申请日期 2008.03.25
申请人 TOKYO DENPA CO LTD 发明人 SAITO YASUSHI;NAKADA YASUSHI;NAKAMA KAZUMASA;SASAKI NORIKAZU
分类号 G01K11/22;G01K1/02;H01L21/66 主分类号 G01K11/22
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