发明名称 CAPACITOR EMBEDDED MULTI-LAYER CERAMIC BOARD
摘要 PURPOSE: A capacitor embedded multi-layer ceramic substrate is provided to reduce thermal stress due to a thermal expansion coefficient between the ceramic layer with high dielectric constant and the ceramic layer with the low dielectric constant using soft metal material filled in a via. CONSTITUTION: A capacitor(10) has at least one ceramic layer(11) with high dielectric constant, a first electrode layer(12), and a second electrode layer(13). A plurality of ceramic layers(31a,31b) with the low dielectric constant are stacked in one side of the capacitor. The ceramic layers with the low dielectric constant have a second thermal expansion coefficient lower than a first thermal expansion coefficient. A first via electrode for reducing the stress passes through one layer among the ceramic layer with the low dielectric coefficient and the ceramic layer with the high dielectric coefficient. The first via electrode for reducing the stress is connected to the first electrode layer and is electrically separated from the second electrode layer. A second via electrode for reducing the stress passes through one layer of among the ceramic layer with the low dielectric coefficient and the ceramic layer with the high dielectric coefficient. The second via electrode is connected to the second electrode layer and is separated from the first electrode layer.
申请公布号 KR20090106191(A) 申请公布日期 2009.10.08
申请号 KR20080031748 申请日期 2008.04.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, HYOUNG HO;LEE, JONG MYEON;PARK, EUN TAE;LYOO, SOO HYUN
分类号 H05K3/46 主分类号 H05K3/46
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