| 摘要 |
Disclosed is an amorphous silica powder having improved HTSL property and HTOL property and therefore suitable as a semiconductor sealing material. Also disclosed is a method for producing the amorphous silica powder. Specifically disclosed is an amorphous silica powder which contains Al in an amount of 0.03 to 20 mass% in terms of Al2O3 content as measured by atomic absorption spectrometry, which has an average particle diameter of 50μm or less, and which, when the particles of the amorphous silica powder are divided into two fractions respectively having a larger particle diameter than the average particle diameter and a smaller particle diameter than the average particle diameter, a fraction having a smaller particle diameter has a higher Al content (in terms of Al2O3 content) than a fraction having a larger particle diameter. |
