| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module small in thickness of the module, and high in reliability by repeated thermal stress fatigue of a joint part. <P>SOLUTION: This power module includes: a plurality of power semiconductor elements 1; a plurality of control elements 3, 4 controlling the plurality of power semiconductor elements; a power circuit 22 driving the plurality of power semiconductor elements; a power circuit board 10 constituting the circuit; a control circuit 21 comprising a plurality of control elements; and a control circuit board 6 constituting the circuit and comprising a control circuit board. The power module is composed by interposing anisotropic conductive rubber 5 in electrical connection between the power circuit board 10 and the control circuit board 6. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
