| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a thin film electronic device wherein resticking after peeling and the breakage of a substrate caused by flection after the peeling are hardly caused, and a method for manufacturing the thin film electronic device. Ž<P>SOLUTION: A peeling apparatus 1 as the apparatus for manufacturing the thin film electronic device peels a transfer source substrate 30 and a transfer destination substrate 40 having been stuck together with a body to be transferred interposed along a lamination interface between the body to be transferred and transfer source substrate 30. The peeling apparatus 1 includes a process 14 which sucks and holds the transfer destination substrate 40, a suction pad 24 as a suction unit which applies a force for separating the transfer source device 30 and the transfer destination substrate 40 in a lamination direction while sucking the transfer source substrate 30, and a nozzle 50 which injects fluid from its tip to the lamination interface along the lamination interface. Furthermore, the peeling device 1 has a stopper 22 which locks the suction pad 24 moving up after the transfer source substrate 30 and the transfer destination substrate 40 are peeled off. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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