| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an edge inspection apparatus for inspecting an applied range of a film applied to a substrate. Ž<P>SOLUTION: A computer 10 of the edge inspection apparatus 1 for inspecting a wafer S, having an outer surface formed with the film extracts a contour of the wafer S from image data DH obtained by imaging so as to cause the wafer edge SE of the wafer S to be parallel to a flat plane of the wafer S. A pixel corresponding to an edge position of the wafer S and a pixel corresponding to a film border position as a border of the film are detected by a change in the radial brightness of a pixel for constituting image data DS, obtained by imaging a to-be-imaged position of the image data DH at an angle θ to the flat plane of the wafer. The film border position in the contour is calculated, corresponding to the distance from the edge to the film border position calculated, based on the detected pixels, the contour of the substrate and the angle θ. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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