| 发明名称 |
EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER |
| 摘要 |
The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
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| 申请公布号 |
US2009242126(A1) |
申请公布日期 |
2009.10.01 |
| 申请号 |
US20090415274 |
申请日期 |
2009.03.31 |
| 申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
ERK HENRY F.;ALBRECHT PETER D.;HOLLANDER EUGENE R.;DOANE THOMAS E.;SCHMIDT JUDITH A.;VANDAMME ROLAND;ZHANG GUOQIANG (DAVID) |
| 分类号 |
C23F1/08 |
主分类号 |
C23F1/08 |
| 代理机构 |
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