发明名称 |
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXPOSED EXTERNAL INTERCONNECTS |
摘要 |
The present invention provides a mountable integrated circuit package system comprising: providing an inner integrated circuit package including a first external interconnect having a shoulder; connecting an intraconnect between a second external interconnect and the shoulder; and forming an outer encapsulation over the inner integrated circuit package, the intraconnect, and partially exposing the first external interconnect on a top encapsulation side of the outer encapsulation and the second external interconnect on a bottom encapsulation side of the outer encapsulation.
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申请公布号 |
US2009243066(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20080054682 |
申请日期 |
2008.03.25 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;ADVINCULA ABELARDO JR;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI |
发明人 |
CAMACHO ZIGMUND RAMIREZ;ADVINCULA ABELARDO JR.;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/538;H01L21/56 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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