PACKAGING DEVICE, METHOD, AND APPARATUS FOR ELECTRONIC COMPONENTS

摘要

A packaging device for electronic components, comprising: a carrier tape having a pair of longitudinally arranged edge surfaces in parallel, a plurality of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; and a cover tape covering the carrier tape. The cover tape is bonded to the two edge surfaces of the carrier tape by laser irradiation heat fusion, so that a laser irradiated heat fusion area is formed to package the electronic components placed in the pockets. Further provided is a packaging method for electronic components and a packaging system for electronic components.