| 摘要 |
PURPOSE: A light emitting diode package and a method for transfer molding of the same reduce consumption of resin by reducing the number of a gate when a groove on a substrate is used as a mold gate. CONSTITUTION: A light-emitting diode package includes a substrate(10), a light emitting diode chip, and a molding unit(30) and it is mounted on the substrate. A molding unit surrounds the light emitting diode chip and forms a lens, and the molding unit is formed by a resin(31) through a transfer molding. More than one groove is formed on the substrate, and it is extended from a molding unit to an edge of the substrate. |
