LED PACKAGE AND ITS ENCAPSULATION MEMBER FORMING METHOD

摘要

PURPOSE: An LED package and an encapsulation member forming method thereof are provided to broaden the directivity angle by increasing the spreading effect of the light within the encapsulating material. CONSTITUTION: An encapsulating material of an LED package solders the LED chip electrically wired on the chip mounting member with the resin of a light-transmissive. The encapsulating material formation method of the LED package is as follows. The heat-hardened silicon powder is prepared(S101). The resin compound of the light-transmissive in which the heat-hardened silicon powder is mixed at a modifier is made(S102). The encapsulating material which solders the LED chip using the resin compound is shaped(S103).