| 摘要 |
A method and apparatus of preparing a wafer by baking a batter which comprises preparing a batter mix comprising at least flour and water, feeding the batter mix intermittently in a batter stream to a batter depositor (22) which deposits batter onto a heated baking surface (23) wherein at an injection point in the batter stream immediately upstream of the batter depositor, at least one further batter ingredient is added to the batter mix to form the batter, depositing a portion of the batter onto the heated baking surface (23) to bake the batter in contact with the heated baking surface for a period of from 20 seconds to 5 minutes, at 130 °C to 220 °C to form the wafer, and removing the wafer from the heated baking surface characterized in that the batter is fed through an in-line mixing device (19) fitted at or downstream of the injection point.
|
