ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME

摘要

Disclosed is an anisotropic conductive film which has improved adhesion strength to circuit members, thereby enabling high conduction reliability. A joined structure and a method for producing the joined structure are also disclosed. Specifically disclosed is an anisotropic conductive film for electrically connecting a first circuit member with a second circuit member which is provided with a film containing nitrogen atoms on a surface facing the first circuit member. The anisotropic conductive film is characterized by comprising a first layer arranged on the first circuit member side, and a second layer arranged on the second circuit member side. The anisotropic conductive film is also characterized in that the first layer contains a cationic curing agent and a first thermosetting resin; the second layer contains a radical curing agent and a second thermosetting resin; at least one of the first and second layers contains conductive particles; and the difference of maximum exothermic peak temperatures between the first layer and the second layer is 20°C or less.