发明名称 |
Complex Semiconductor Packages and Methods of Fabricating the Same |
摘要 |
Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor packages. An exemplary complex semiconductor package includes a first package including: a first packaging substrate; a plurality of first semiconductor chips disposed on the first packaging substrate; and a first sealing member covering the first semiconductor chips on the first packaging substrate; and at least one second package separated from the first packaging substrate, disposed in the first sealing member, and including second semiconductor chips.
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申请公布号 |
US2009243061(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20090413399 |
申请日期 |
2009.03.27 |
申请人 |
YANG GWI-GYEON;LIM SEUNG-WON |
发明人 |
YANG GWI-GYEON;LIM SEUNG-WON |
分类号 |
H01L23/52;H01L21/98;H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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