PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

摘要

A printed wiring board comprises a resin insulating layer having a first recess for a first conductor circuit provided on a first surface side and a first opening for a first via conductor, a pad for mounting a component formed on a second surface located on the opposite side to the first surface in the resin insulating layer and mounting an electronic component, and a first via conductor formed in the opening and connecting the pad for mounting a component with the first conductor circuit, wherein the side surface of the first conductor circuit is tapered toward the side of a pad for mounting a component. Consequently, a stress being applied to an inner layer conductor layer is reduced, cracking in the insulating layer can be suppressed suitably and flatness of a substrate is ensured.