发明名称 |
INTERCONNECTION SYSTEM ON A PLANE ADJACENT TO A SOLID-STATE DEVICE STRUCTURE |
摘要 |
<p>An interconnection system is provided for a solid-state device. The solid-state that includes, a first layer, multiple devices and a first face. A second layer is bonded to the first face at a bonded face of the second layer that faces the first face. Electrically conductive bonds are between the fist and second faces. Conductive paths are on the bonded face of the second layer and connect two or more of the conductive bonds.</p> |
申请公布号 |
WO2009120900(A2) |
申请公布日期 |
2009.10.01 |
申请号 |
WO2009US38456 |
申请日期 |
2009.03.26 |
申请人 |
ENDEVCO CORPORATION;WILNER, LESLIE, BRUCE |
发明人 |
WILNER, LESLIE, BRUCE |
分类号 |
H01L29/84;H01L23/535 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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