HIGH-FREQUENCY SUBSTRATE AND HIGH-FREQUENCY MODULE

摘要

A high-frequency substrate is formed by a dielectric substrate having: a first surface on which is formed a coplanar line having a signal line for transmitting a signal and a pair of first-surface-side ground pattern arranged in parallel to sandwich the signal line; and a second surface which is covered by a second-surface-side ground pattern. A plurality of conductive via holes are arranged at a constant interval for making connections between the first-surface-side ground pattern and the second-surface-side ground pattern. The high-frequency substrate includes: a signal line path separation unit for separating the signal line; a signal line path capacitor of a substantially rectangular parallelepiped shape formed to connect the separation ends of the signal line; and a ground pattern separation unit arranged at both neighbors of the signal line separation unit of the signal line so as to separate the first-surface-side ground pattern.