POWER DEVICE PACKAGE HAVING THERMAL ELECTRIC MODULE USING PELTIER EFFECT AND THE METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A power device package including a thermo-electric module using a peltier effect is provided to perform a smart power module or an intelligent power module by forming a power semiconductor chip and a control semiconductor chip with one package. CONSTITUTION: A power device package(10) includes a thermo-electric module(100), a lead frame(120), one or more power semiconductor chips(140,142), one or more control semiconductor chips(144,146), and a sealing material(160). The thermo-electric module includes a first surface(112) and a second surface(114). The lead frame is attached on the first surface of the thermo-electric module through a lead frame bonding member(110). The power semiconductor chips are mounted on the lead frame. The control semiconductor chips are mounted on the lead frame.